varistor products ?2010 littelfuse, inc. revision: june 28, 2010 0201 mla varistor series surface mount multilayer varistors (mlvs) > 0201 mla series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/0201mla.html for current information. 0201 mla series 0201 mla varistor series rohs description new 0201-size mla multi-layer varistor (mlv) series can protect small electronic products from electrostatic discharge (esd) and electrically fast transients (eft). it's ultra-compact 0201 size, the smallest form factor available for mlv devices, is ideal for compact handheld products. the ml series is manufactured from semiconducting ceramics, and is supplied in a leadless, surface mount package. plating consists of silver base material (which is ?red on to the zno dialectric), nickel barrier plated under-layer and matte-tin outer surface plate. features ? ultra-small 0201 size for minimal board space ? low capacitance (33pf) for high data rates to minimize signal distortion ? meets iec 61000- 4-2 for esd ? low leakage (<25a) ? multilayer ceramic construction technology ? inherently bi-directional ? stable performance over wide operating and storage temperature range -40c to +85c ? operating voltage v m(dc) = 5.5v ? rated for surge current (8 x 20 s) applications absolute maximum ratings steady state applied voltage: unit maximum dc voltage (v m(dc) ) 5.5 v maximum ac voltage (v m(ac)rms ) 4.0 v transient: non-repetitive surge current, 8/20 s waveform, (i tm ) 4.0 a temperature: operating ambient temperature range (t a ) -40 to +85 oc storage temperature range (t stg ) -40 to +85 oc ? portable / handheld electronic devices ? mobile communications / cellular phones ? usb, video and audio ports ? analog signal / sensor lines ? data, diagnostic i/o ports ? computer / dsp products ? industrial instruments including non-life sustaing medical equipment device ratings and speci?cations part number maximum ratings @ + 85o c speci?cations @ +25o c maximum continuous working voltage maximum non- repetitive surge current (8/20 s) maximum clamping voltage at 1a (8/20 s) nominal voltage at 1ma dc test current typical capacitance at f = 1mhz v m(dc) v m(ac) i tm v c v n(dc) min v n(dc) max c (v) (v) (a) (v) (v) (v) (pf) v5.5mla020133nr 5.5 4.0 1 28.0* 8.0 14.0 33.0 v5.5mla020147nr 5.5 4.0 1 26.0* 8.0 14.0 47.0 v5.5mla020164nr 5.5 4.0 1 26.0* 8.0 14.0 64.0 notes: - typical leakage at 25oc at v m(dc) : 0201 size <10 a typical, <25 a maximum - end surface ?nish of matte-tin with nickel under-layer on silver base material - standard packing quantity 15,000 per reel, 7" reel
varistor products ?2010 littelfuse, inc. revision: june 28, 2010 0201 mla varistor series surface mount multilayer varistors (mlvs) > 0201 mla series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/0201mla.html for current information. t 1 t 2 100 50 0 o 1 time percent of peak value t peak pulse current test waveform for clamping voltage 0 1 = virtual origin of wave t = time from 10% to 90% of peak t 1 = rise time = 1.25 x t t 2 = decay time example - for an 8/20 s current waveform: 8 s = t 1 = rise time 20 s = t 2 = decay time reliability and environmental speci?cations judge criteria test condition solderability > 95% solder coverage 245 +/- oc, 3 +/- 1 sec. leaching resistance > 95% solder coverage 245 +/- oc, 3 +/- 1 sec. high temperature exposure vv / vv < 10% 1000 hours 85oc, un-powered thermal shock vv / vv < 10% -45 to +85 oc, 30 min. cycle, 5 cycles operating life vv / vv < 10% 85 oc, dc working voltage 1000 hours bias humidity vv / vv < 10% 40 oc / 85% rh, dc working voltage 1000 hours multilayer internal construction grains depletion fired ceramic dielectric region metal electrodes depletion region metal end termination to avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. when using a re?ow process, care should be taken to ensure that the ml chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. during the soldering process, preheating to within 100 degrees of the solder's peak temperature is essential to minimize thermal shock. once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. one possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. the boards must be allowed to cool gradually to less than 50o c before cleaning. leadCfree (pb-free) soldering recommendations maximum temperature 260?c, time within 5?c of peak 20 seconds maximum preheat zone ramp rate <3?c/s 60 - 150 sec > 217?c temperature c time (minutes) 300 250 200 150 100 50 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0
varistor products ?2010 littelfuse, inc. revision: june 28, 2010 0201 mla varistor series surface mount multilayer varistors (mlvs) > 0201 mla series speci?cations are subject to change without notice. please refer to www.littelfuse.com/series/0201mla.html for current information. 0201 mla series product dimensions (mm) note : avoid metal runs in this area, parts not recommended for use in applications using silver (ag) epoxy paste. pad layout dimensions c b a note chip layout dimensions e l w d dimension 0201 size in mm a 0.055 1.40 b 0.020 0.50 c 0.020 0.50 d (max.) 0.014 0.35 e 0.008 -/+0.004 0.20 -/+0.10 l 0.024 -/+0.002 0.60 -/+0.05 w 0.012 -/+0.002 0.30 -/+0.05 part numbering system v 5.5 0201 packing options device size: device family littelfuse tvss device r maximum dc working voltage mla xx n capacitance option 33 = 33pf 47 = 47pf 64 = 64pf end termination option multilayer series designator n = nickel barrier option (matte tin outer surface, plated on nickel underlayer plated on silver base metal) r = 7in (178mm) diameter reel, paper carrier tape 15,000 items per reel 0201 = .024 inch x .012 inch (0.6 mm x 0.3 mm) tape and reel speci?cations symbol description dimensions in millimeters 0201 a 0 width of cavity 0.36 -/+0.02 b 0 length of cavity 0.70 -/+0.02 w width of tape 8.0 -/+0.1 f distance between drive hole centers and cavity centers 3.5 -/+0.05 e distance between drive hole centers and tape edge 1.75 -/+0.05 p 1 distance between cavity centers 2.0 -/+0.05 p 2 axial drive distance between drive hole centers & cavity centers 2.0 -/+0.05 p 0 axial drive distance between drive hole centers 4.0 -/+0.1 d 0 drive hole diameter 1.55 -/+0.05 t 1 top tape thickness 0.42 -/+0.02 k 0 t 1 d 0 p 0 d 1 p 1 a 0 p 2 b 0 f e w for t and h pack options: plastic carrier tape for r pack options: embossed paper carrier tape embossment top tape 8mm nominal product identifying label 178mm or 330mm dia. reel note: it is recommended that parts be kept in the sealed bag provided and that parts be used as soon as possible when removed f rom bags.
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